Coombs' Printed Circuits Handbook

Book Description

Resolve all your workaday questions with the PCB answer book.

Defining the best in printed circuit board design and technology and unparalleled in thoroughness and reliability, Coombs' PRINTED CIRCUITS HANDBOOK, Fifth Edition provides definitive coverage of every facet of printed circuit assemblies, from design methods to manufacturing processes. This new edition of the most trusted guide to pcbs gives you:

* Exhaustive coverage of HDI (High Density Interconnect) technologies including design, material, microvia fabrication, sequential lamination, assembly, testing, and reliability
* Coverage of fabrication developments including: blind and buried vias, controlled depth drilling, direct imaging, horizontal and pulse plating
* Thorough examination of base materials, including traditional and alternative laminates
* Understanding of effective quality and reliability programs, including: test & inspection, acceptability criteria, reliability of boards and assemblies, process capability and control
* Full treatment of multi-layer and flexible printed circuit design, fabrication and assembly advanced single- and multi-chip component packaging
* Contributions from pros at Motorola, Cisco, and other major companies
* Included CD-ROM, with the entire book in searchable format
* Hundreds of illustrations and instant-access tables, and formulas

Customer Reviews:

I agree.......2006-12-05

I agree with the majority of the reviews here. This is an invaluable reference book. Put it this way, this book will likely save you at least one re-spin on a complex board. That alone will pay for it's cost many times over.

Cheers,

Must have reference book.......2005-01-07

The only reason I give this book a 4 star rating is because of the information that was removed from fourth to fifth edition. To serve as a complete reference you must buy both editions. The topics covered are significantly different.

Excellent books. Must have for any person involved in Printed circuit board industry.

Not for designing PCB.......2002-07-26

I bougth this book to have a reference on the desing of PCB. (How wide to design the traces, what distance should i use betweeen traces...) I found it prety useless.

Nevertheless, it is a goog book to undestand the process and manifacturing of PCB, if this is your business

No set complete without this reference book!.......1999-06-22

Complete coverage by a number of writers with diverse backgrounds. The highest praise I can give is that I use it daily!

A good book for the engineering shelf but needs updating.......1999-02-20

This is a good book that has been around in earlier editions. The editor has done a credible job of finding knowledgeable people to write for him. I have used all of the earlier editions of this book at one time or another and have found it helpful along the way but it needs updating more often to avoid becoming a history book.

Average customer rating:

welding
Great prep for welding classes
Very good book.
Super! Carry it in your toolbox for Oxy Welding
Excellent starter book for oxyacetylene!

Welding
Don Geary
Manufacturer: McGraw-Hill Professional
ProductGroup: Book
Binding: Paperback

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ASIN: 0071342451

Book Description

This hands-on guide to welding covers everything a beginner needs to know to work safely and productively with welding equipment. Starting with the basics of setting up a welding outfit and with a focus on oxyacetylene welding, this book discusses new processes, fuels, equipment, supplies and welding techniques in an easy-to-understand format. It even covers safety issues and how to set up your own welding workshop. it also provides welding projects for beginners to try out what they've learned. Its an ideal hands-on learning tool for beginners and an excellent bench reference for experienced welders.

Customer Reviews:

welding.......2007-07-16

For the novice only, Broad coverage of oxyaectylene welding and cutting, soldering and general information pertaining to various metals. Only a brief mention of arc welding though. 5 star rating only for those not interested in arc welding !!!

Great prep for welding classes.......2007-01-09

When I purchased this book I had already scheduled a stick welding class at the local vocational school. I wanted something that would help me not seem like a total noob when I got there. This book helped out greatly! This is a very infomative book and provides a good overview of all welding types.

Very good book........2006-01-06

I like this book a lot. Good information. One sentence annoys me though. On page 7 the author states, "Pure oxygen is flammable." This is a false statement. It made me wonder if he ever used an oxyacetylene outfit when I first read it. Who hasn't accidentally tried to light the oxygen first instead of the acetylene and found that nothing happens? Higher concentrations of oxygen increase the rate of oxidation/combustion but oxygen isn't a fuel, i.e., it isn't flammable. But pure oxygen makes things that are flammable more dangerous.

The rest of the books shows that he know what he's talking about on other topics.

I recommend the book. I couldn't find many books with so much information on oxyacetylene welding. I feel that I was lucky to find this information in a book that is also a well written book.

Super! Carry it in your toolbox for Oxy Welding.......2004-12-11

If you can afford only one book on Oxy Welding get this one, no make that two so you can have one in you toolbox and one to replace it when the one in your toolbox "grows legs" and walks off. This is "thee" book for the practical weldor and fits nicely into your toolbox. Read it, use it, take it with you where ever you go to work. The author is writing to you as your coworker not as an instructor or engineer though he is still showing you how to do it correctly and SAFELY.

Excellent starter book for oxyacetylene!.......2002-11-16

There are so many books on welding that it is hard to figure out which one will be best for you, especially if you are a beginner.
One of the first things as a beginner is to start with oxyacetylene (gas) welding. The problem is that with most welding books, they try to focus on ALL welding forms and there is a lot of information that gets left out. For oxyacetylene welding, this is THE book. It's COMPLETE focus is on oxyacetylene. That's the bonus about this book, and it really comes across well for the beginner. If you don't know anthing about welding and want to start, buy this book! It's loaded with easy to follow instructions, practical tips, and great step-by-step procedures. It even goes into the physics and metals and thier properties in a down to earth, easy-to-comprehend way!
On the downside, the 10 easy-to-follow projects should have been chosen better because some are not applicable to the average welder (like a hay manger and farm gate).
Bottom line: When I read this book I was so pleased that I didn't put it down until I was finished. If you want to focus on oxyacetylene then this is the book for you.

Fusing Fabric: Creative Cutting, Bonding and Mark-Making with the Soldering Iron

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Fusing Fabric: Crative Cutting,Bondingand Mark-Making with the Soldering Iron
New and intruiging fiber process
Know what you are getting into
Very Interesting Book!
Opens your eyes to possiblities

Fusing Fabric: Creative Cutting, Bonding and Mark-Making with the Soldering Iron
Margaret Beal
Manufacturer: Batsford
ProductGroup: Book
Binding: Hardcover

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ASIN: 0713489561

Book Description

It’s the latest and hottest idea in embroidery today, expanding the reach of textile art: the use of a soldering iron to cot, bond, and etch fabric. And Margaret Beal is the pioneer of the practice. For the first time, she gathers her expertise in book form, with photographs showing finished pieces and diagrams and drawings illustrating the process. All the principal techniques are thoroughly explained, from choosing and cutting fabric to using three-dimensional materials. Appliqué, reverse appliqué, shadow work, piercing, weaving, and bead making all receive in-depth coverage. Projects range from a pocket mirror to a variety of brooches.

Customer Reviews:

Fusing Fabric: Crative Cutting,Bondingand Mark-Making with the Soldering Iron.......2007-05-31

Found this book to be very well issustrated and clear and conciss directions well laid out

New and intruiging fiber process.......2007-05-10

Another reviewer has said there was no mention of where to buy a soldering iron. Well, I emailed the author and promptly got one mailed to me. No problem. Definitely use with good ventilation and a respirator, especially if you are 'burning' plastic materials.I am enjoying experimenting with the process.Well written, clear instructions.

Know what you are getting into.......2006-10-31

The idea of fusing together synthetic fabrics by melting them with a soldering iron is a creative one. However, on opening the book, the reader is advised of the need for a respirator and an extractor fan to protect against toxic fumes. This is not to be taken lightly. A fire extinguisher might also be recommended.
For those who decide to forge ahead, it might also have been helpful to have more guidance included about what to search for in a soldering iron. It is not helpful to say that we do not want it "too hot" or "too cool".

Very Interesting Book!.......2006-07-17

I am very excited about trying projects found in this book. Margaret Beal gives clear instructions, but yet allows you to express your own creativity. I will be trying these techniques soon!

Opens your eyes to possiblities.......2006-07-05

Its amazing what I have seen done with Soldering Irons of late! I am impressed with these women - but especially Margaret Beal. She realized that it could be an "iron" of sorts. Its a lesson in what can be done to synthetics if we only remember how many we have burned with a normal iron. Ms. Beal has learned how to control that burn and with an even hotter utensil - the soldering iron. . I especially loved the "pillows".

I bought this book without seeing it first and am so glad I did not have to wait until the Quilt Show in Houston to find a copy to check out. Definitely I would buy a book by Ms. Beal sight unseen again!

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Average customer rating:

The Practical Science of Reflow Soldering
Solving your solder-reflow problems!

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies
Ning-Cheng Lee
Manufacturer: Newnes
ProductGroup: Book
Binding: Hardcover

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ASIN: 0750672188

Book Description

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel.

Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable.

Provides engineers the cutting-edge technology in a rapidly changing field

Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

Customer Reviews:

The Practical Science of Reflow Soldering.......2002-10-05

Few people have made more contributions to reflow soldering than Dr. Lee has. He has been a driving force in taking surface mount technology (SMT) from an art to a science. This book is a compilation of these successes with ample references to the important work of others. Those who work in this field will find this book indispensable in setting up and optimizing SMT assembly processes. In my opinion Dr. Lee's book is unequal in its value to practitioners in SMT.

Solving your solder-reflow problems!.......2002-04-26

This excellent book on reflow soldering, by noted expert Doctor Ning-Cheng Lee, offers a unique approach that will be invaluable to anyone concerned with practical applications of microelectronics packaging.

Many books, including this one, tell you how reflow soldering should work. Dr. Lee's book goes beyond those basics, to tell you in great detail what most other books do not long dwell upon: what to do when reflow soldering does not work as expected. How to identify the problems. How to cure or compensate for problems to achieve good solder reflow interconnections. How to use the defects themselves to eliminate defects and to optimize your solder reflow process.

The first four chapters are a clear and complete exposition of reflow soldering and of surface mount assembly processes. They cover surface mount technology in general, solders and solder pastes, and the beginning-to-end steps in surface mount assembly. Nourishment for the technical mind ranges from the organic chemistry of fluxes to equations relating surface tension and solder spread. These four chapters provide an excellent summary of how reflow soldering is supposed to work.

The next seven chapters place a strong focus on trouble-shooting. Not on how things go when all is well, but on what things can go wrong, and how to fix, to compensate for, or to work around them when they do go wrong. The logical structure is clear: three chapters on reflow problems, titled "Before Reflow," "During Reflow," and "After Reflow." Three chapters on the special techniques and the potential problems encountered in solder bumping area array packages, in assembling and reworking BGA & CSP packages, and in reflowing solder-bumped flip chips. Each chapter first covers the required materials and processes, and then details all of the potential problems that might be encountered, and how best to solve them.

The capstone chapter describes how to optimize a reflow process through the proper analysis of the defect mechanisms encountered. This chapter requires 39 sub-sections to systematically step through identifying, analyzing, and correcting defects. It turns defect analysis into a powerful tool for optimizing the reflow process. Further discussion extends this optimization approach to other alloys and systems, and suggests that your creativity might carry it still further.

The final chapter is a now-obligatory look at the "lead-free" juggernaut bearing down on the industry, with some recognition that this juggernaut carries its own baggage of potential problems.

Dr. Lee makes good use of the large (7 by 10 inch) format to place multiple graphics on almost every page. At less than one inch thick, this 280-page book can be easily slipped into an ordinary briefcase, and carried without muscle strain. Some current reviews incorrectly state that this book has 384 pages. Apparently they copied another book's page count from the multiple back cover blurbs, instead of opening the book themselves.

Book Description

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

Metal: Forming, Forging, and Soldering Techniques

Average customer rating:

Title misleading

Metal: Forming, Forging, and Soldering Techniques
Jose Antonio Ares
Manufacturer: Barron's Educational Series
ProductGroup: Book
Binding: Hardcover

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Accessories:

The Complete Jewelry Making Course: Principles, Practice and Techniques: A Beginner's Course for Aspiring Jewelry Makers

ASIN: 0764158961

Book Description

Metal is an unusually satisfying medium for many artists, but working in metal requires a considerable amount of specialized knowledge and practical skill. This book teaches those skills. It makes a fine textbook for apprentice metalworking artists, presenting a basic overview of the science of metallurgy, then discussing needed tools, safety equipment, and metalworking methods. Detailed chapters cover such techniques as welding, shaping, and cutting metals as a means of fashioning art objects and practical items. A variety of beautiful and useful objects are shown as they are being made in a series of step-by-step photos. Objects include weather vanes, wrought-iron decorative fixtures for inside and outside the home, trays, tables, and imaginative sculptures. Students are instructed in how to work with iron, aluminum, copper, zinc, and several other metals. The book is filled with hundreds of color illustrations.

Customer Reviews:

Title misleading.......2007-08-09

The Title is(Metal Forming, Forging, and Soldering Techniques)
There is entirely too much of the book on tools and how to use them. I already know how to use the tools but I do need more info. on forming metal. I can get a free Sears tool catalog and have tools. I do not feel that it was worth the $12.95+ shipping. I was looking for the "techniques" on how to do the bending, forming, etc. It did not meet my need or expectations.

Soldering and Brazing (Workship Practice, No 9)

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Soldering and Brazing (Workship Practice, No 9)
Tubal Cain
Manufacturer: Trans-Atlantic Publications
ProductGroup: Book
Binding: Paperback

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ASIN: 0852428456

Optimizing Quality in Electronics Assembly: A Heretical Approach

Average customer rating:

An essential reference for electronics Mfg/Engr/QA folks!

Optimizing Quality in Electronics Assembly: A Heretical Approach
James Allen Smith , and Frank B. Whitehall
Manufacturer: McGraw-Hill Professional
ProductGroup: Book
Binding: Hardcover

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ASIN: 0070592292

Book Description

In a radical departure from the dozens of other quality books, this one makes the case that the traditional TQM procedures used in the electronics assembly field are not only ineffective--they contribute to many failures. The only book to focus exclusively on quality in electronics manufacturing--and to propose a measurable cost/benefit methodology--this provocative volume shows what's lacking in current quality programs, and how fresh approaches can yet avoid a quality ``catastrophe'' in the electronics industry. Along the way, numerous quality myths are exploded, hidden issues are confronted, and an array of electronics specific solutions are offered.

Customer Reviews:

An essential reference for electronics Mfg/Engr/QA folks!.......1997-09-01

The authors have used real-world measures of quality (=dependability) to define a strategy for improving the TRUE QUALITY of manufacturing output for electronic products and sub-assemblies. If you're involved in electronic design and manufacturing (as I am), chances are your present employer is doing many costly things in the name of Quality that you KNOW are counterproductive. This gem of a book points out a lot of these practices, and provides OBJECTIVE EVIDENCE about how they're bad and why we do them anyway. And if you're like me, this book will also point out a few things you DIDN'T KNOW where counterproductive, too. Reading and studying this book has made me DETERMINED to fight the forces of pseudo-quality that are a growing menace within the company I work for. Wish me luck!

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® (The International Series in Engineering and Computer Science)

Average customer rating:

The essential guide for solder reliability analysis with ANSYS

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® (The International Series in Engineering and Computer Science)
Erdogan Madenci , Ibrahim Guven , and Bahattin Kilic
Manufacturer: Springer
ProductGroup: Book
Binding: Hardcover

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ASIN: 1402073305

Book Description

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.

Customer Reviews:

The essential guide for solder reliability analysis with ANSYS.......2006-09-14

This text is a gem. The included add-on package for ANSYS alone is worth twice the price of this book. The reader is first introduced to the theoretical basis of fatigue life prediction, a rather thorough survey of research done in the electronic packaging field. The chapters that follow explain step by step how a detailed FEA model can be created very efficiently using the provided addon package called ReliANS. Highly recommended for any engineer wanting to exploit ANSYS for more reliable package design, and others who wish to improve on their current methods.