Microelectronics Packaging Handbook, Part I: Technology Drivers (Microelectronics Packaging Handbook)

Book Description

This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables.
Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development.
Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail.
Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.

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Informatinal guide to IEEE1149.1

The Boundary-Scan Handbook

Manufacturer: Springer
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Binding: Hardcover

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ASIN: 1402074964

Book Description

Boundary-Scan, formally known as IEEE/ANSI Standard 1149.1-1990, is a collection of design rules applied principally at the Integrated Circuit (IC) level that allow software to alleviate the growing cost of designing, producing and testing digital systems. A fundamental benefit of the standard is its ability to transform extremely difficult printed circuit board testing problems that could only be attacked with Ad-Hoc testing methods into well-structured problems that software can easily and swiftly solve.

IEEE testing standards of the 1149 family are living entities that grow and change quickly. The Boundary-Scan Handbook, Third Edition is intended to describe these standards in simple English, rather than the strict and pedantic legalese encountered in the standards. Over 180 drawings and 40 tables illustrate important concepts. Forty-six Design-for-Test rules are provided, with complete explanations.

The fundamental 1149.1 standard is now over 13 years old and has a large infrastructure of support in the electronics industry. Today, a majority of custom ICs and Programmable Logic Devices have 1149.1 implementations. The Boundary-Scan Handbook, Third Edition updates the information about 1149.1, which has been revised as recently as 2001. It contains a description of the 1149.4 "Analog Boundary-Scan" standard, and gives a tutorial on analog testing technology. It then introduces the recently released IEEE 1149.6 "Advanced I/O" standard, which extends Boundary-Scan to deal with AC-coupled differential signaling now becoming common in higher performance system. Finally, since a board test system provides a suitable environment for programming non-volatile Programmable Logic Devices, the IEEE 1532 standard is described which extends the 1149.1 access protocol into the device programming domain. This forms an essential tool for testing boards and systems of the future.

Customer Reviews:

Informatinal guide to IEEE1149.1.......2003-03-13

Since the mid-1970s, the structural testing of the loaded printed circuit boards (PCBs) has relied very heavily on the use of the so-called in-circuit "bed-of-nails" technique. This method of testing makes use of a fixture containing a bed-of-nails to access individual devices on the board through test lands laid into the copper interconnect, or other convenient contact points. Testing then proceeds in two phases: the power-off tests followed by power-on tests. Power-off tests check the integrity of the physical contact between nail and the on-board access point. They then carry out open and shorts tests based on impedance measurements. Power-on tests apply stimulus to a chosen device on a board, with an accompanying measurement of the response from that device. Other devices that are electrically connected to the device-under-test (DUT) are usually placed into a safe state (a process called "guarding"). In this way, the tester is able to check the presence, orientation, and bonding of the DUT in place of the board.

Fundamentally, the in-circuit bed-of-nails technique relies on physical access to all devices on a board. Such was the technique in the mid-1980s when a group of concerned test engineers got together to examine the problem and its solutions. The method of solution was based on the concept of a serial shift register around the boundary of the device - hence the name "boundary scan".

Principles of Boundary Scan
Each primary input signal and primary output signal is supplemented with a multi-purpose memory element called a boundary-scan cell. Cells on device primary inputs are referred to as "input cells"; cells on the primary output are referred to as "output cells". The input and outputs is relative to the core logic of the device. The collection of the boundary cells is configured into a parallel-in, parallel-out shift register. A parallel load operation, called a "capture" operation, causes signal values on device input pins to be loaded into input cells and, signal values passing from the core logic to the device output pins to be loaded into output cells. A parallel unload operation called an "update" operation causes signal values already present in the output scan cells to be passes out through the device output pins. Signal values already present in the input scan cells will be passed into the core logic.

Data can also be shifted around the shift register, in serial mode, starting from a dedicated device input called TDI and terminating at a dedicated device output pin called TDO. The test clock TCK, is fed in via another dedicated device input pin and the mode of operation is controlled by a dedicated TMS serial control signal. At the device level, the boundary scan elements contribute nothing to the functionality of the core logic. In fact, the boundary scan path is independent of the function of the device. On board the four; boundary scan devices are connected from one to the next in a serial format. The TDI input to the board is connected to the TDI input of the first device; the TDO output of the first device is connected to the TDI input of the next device; and so forth; creating a global scan path terminating at the TDO connecter output. TCK is connected in parallel to each device, TMS the control pin works similarly.

In this way, particular tests can be applied to the device interconnects via the global scan path by loading the stimulus into the appropriate device output scan cells via the edge connecter TDI (shift-in operation), applying the stimulus (update operation), capturing the responses at the device input scan cells (capture operation), and shifting the response values out to the edge connector TDO (shift-out operation). Essentially the boundary scan cells can be thought of as the "virtual nail".

Book Description

This is a clear, up-to-the-minute guide to controlling all types of motors—with precise, adaptable intelligence. Featuring the latest in electronics technology, this expert-written guide gives you everything from the fundamentals to cutting-edge design tips, including real-life examples with software code. With this insider's guide to electronic control technology, you'll be ready to make motors work better now and into the future.

Customer Reviews:

Good addition to your motor control library........2002-01-30

Overall, the book presents fairly practical hardware solutions to motor controllers design from industrial, automotive, to appliances.
It is a good book for those doing motor controller designs. It covered power device protection well and author seems to have practical experience and says when he has or has not tried out circuits presented in the book.
For those doing a lot of detailed control algorithyms, like PID, adaptive etc., or firmware development, if you are using motorola microcontrollers, the example code works well, however since flow chart or description of algorithym is not presented, and is buried in the code example, you are out of luck. Also, I think if it expands to cover DSP, and multiaxis controllers, it would be great. More details on the actual applications of say
speed or torque control using position feedback like digital encoders may help those beginners in motor controls.
I agree with another reviewer that it is one of the better books on motor control electronics that is out there. Definitely, a good companion to a firmware book on controls or actual application notes on application of micro or dsp's in motor controls.

Comprehensive book on motor control.......2001-04-19

Excellent book covering all aspects of motor control. This book did a very good job of covering control electronics, intermediate drive electronics and power devices. In addition it covered distributed drive controllers, sources of noise, and design principals. It had examples of a range of motor drive types including AC, DC PM, brushless, etc. It relied a little too much on Motorola parts but all in all it was an excellent book and a valuable resource.

Motor Control Electronics Handbook.......1999-10-20

Motor Control Electronics Handbook by Richard Valentine(Editor

good book on variable speed theory........1999-05-09

I have been interested in electric motor controls for use in robotics for some time. This is the best book on the subject I have found so far. The book assumes you have a fairly complete knowledge of IGBTs, Mosfets and a solid background in electronics. Lacks important information on 3 phase, two phase, and single phase induction motor operation theory. Has good description of various problems produced by variable speed drives. There is a good theoretical overview of variable speed drive techniques.

Handy Farm Devices: And How to Make Them

Average customer rating:

Fantastic book that can save you time and money
Great!
Historical and functional
Great Ideas...don't expect to build them.
Depends on what you're looking for...

Handy Farm Devices: And How to Make Them
Rolfe Cobleigh
Manufacturer: The Lyons Press
ProductGroup: Book
Binding: Paperback

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ASIN: 1558214321

Amazon.com

Originally published in 1909, "Handy Farm Devices" is more than an engaging trip down memory lane. For any small farmer or homesteader, the techniques and devices described in detail are just as useful, durable, and fully functional today as they were 75 years ago. You will learn to build a portable chicken coop, a stone boat (for moving stone), a lightweight orchard ladder, gates that don't sag, and a handy wood splitter, as well as rudimentary farm structures, well houses, bee hives, a baby's cradle, a cheese press and much more. The charming, turn-of-the-century language and useful and inspirational quotes from Shakespeare, the Bible, Bacon, Longfellow and many others make this book a delight to read. --Mark A. Hetts

Book Description

Practical projects as useful today as when first published 75 years ago.

Customer Reviews:

Fantastic book that can save you time and money.......2007-09-25

"Success comes to the man who so works that his efforts will bring the most and the best results-not to the man who simply works hard." Very elequently stated by the author from page three in the introduction of this gem of a little book.

Call me a survivalist, but I feel books such as these are going to become imperative in the future of america for both the suburbanite and country boy alike. Handy Farm Devices by Rolfe Cobleigh is a must own to anyone who owns or is even thinking about owning their own homestead. This book allows you to make just about anything you could possibly need around a private farm/homestead. Just to name a few things that are tucked away in the pages of this litte gem are How To: use a carpenters square, build stairs, temporary animal housing, a cellar, make your own dresser drawers, feeders for your animals, make a chicken coop from a barrel (and other chicken, pig, horse, and cattle housing designs as well), laying cement foundations, simple housing plans, how to build a concrete stone house for $400 dollars, build your own wheelbarrel, plus various orchard and planting ideas as well as other ideas that are so numerous I can't possibly mention them all.

The only thing this book will not do is give you a step by step guide on how to go about doing X,Y, and Z. It gives you pointers and a general push in the right direction, but it doesn't give you in depth direction. I only see this becoming problematic if you were to take on the task of building one of the houses described in this book. However, I don't see in depth directions being an issue for most of the devices mentioned. Even a modest amount of ingenuity should be sufficient in most cases. In the end this book delievers all that it reasonably can in less than 300 pages. A must have for those interested in homesteading, and those who believe that true self-sufficiency will become a necessary skill in the future of this country.

Great!.......2007-09-06

This book is a "must have" because of all the great ideas.
Today you can just buy all the stuff but this would be very costly.
This little book shows how to build everything you need by yourself.
I'm starting a very small farm for selfsuffiency and was desparate about the costs of all the needy things.
This book will spare me hundreds of $, it's really great.

Historical and functional.......2007-08-13

This book is full of historical information about devices, buildings and just useful things. This guide would be useful in areas or farms trying to live without elecrical equipment and in cases of disasters to make do until some assistance with more modern means arrives. I enjoyed the writing and would recommend the book to those looking to do things more "natural".

Great Ideas...don't expect to build them........2007-05-12

This is a great and fun little book full of old fashion devices. Treat it as an idea book, but don't expect explanations of how-to here. For at least half of the devices you won't need any explanation, the others look the info up somewhere else.

Depends on what you're looking for..........2007-01-10

This was a nice, fun book to read... but it was essentially useless for actually helping you build any of the things it talks about (and gives interesting history and info about). So for a practical DIY book, it's useless, but for a book just to learn a bit about this stuff and it's history and get a frame of reference, it's not bad at all.

Average customer rating:

a comprehensive guide to materials and processes
Mostly mechanical, with basic electronics.
Review of Electro-Mechanical Design Handbook

Electromechanical Design Handbook
Ronald A. Walsh
Manufacturer: McGraw-Hill Professional
ProductGroup: Book
Binding: Hardcover

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Machine Devices and Components Illustrated Sourcebook

ASIN: 0071348123

Book Description

A-Z guide to electrical/electronic and mechanical engineering design data. The ultimate sourcebook of electro-mechanical engineering design data is now better than ever, with thoroughly updated material, new discussions of engineering economics and elastomer springs. and a bounty of new drawings. Electro-Mechanical Design Handbook, Third Edition, by Ronald A. Walsh, gives you the know-how you need to develop parts, mechanisms, and assemblies, with thorough explanations of: *Properties, uses, and strength of engineering materials *Machine element design and mechanisms *Basic pneumatics, hydraulics, air handling and heat *Fastener and joining techniques *Layout and fabrication practices, including castings, moldings, extrusions and powder metal technology *Finishes and plating practices *Dimensioning and tolerancing practices *Much, much more!

Customer Reviews:

a comprehensive guide to materials and processes.......2001-12-06

This is a very technical handbook for a working mechanical, or electro-mechanical engineer. It includes charts of materials, their densities, their dielectric constants, cross sections of bearings, mechanisms for translating rotary motion into linear motion, page after page of descriptions of fasteners, torque ratings for different screws, pictures of industrial lathes, analysis of mechanical damage suffered by high current machinery due to electrical fields, etc.

Fascinating, if you're the kind of person who subscribes to Home Shop Machinist, but not light reading by any means.

Mostly mechanical, with basic electronics........2001-08-27

Electro-mechanical suggests the book would have info on motors, solenoids, and other electromechanical items, but it has very little. It's mostly mechanical & general engineering stuff, with a very basic chapter on electrical components. Throughout the book, it goes into excessive detail on subjects where the author had material on hand, and glosses over other important areas. If you were going to buy this and Walsh's other book, Machining and Metalworking, buy both Machinery's Handbook and Christiansen's Electronics Engineers' Handbook instead as these cover all the samesubject matter and more.

Review of Electro-Mechanical Design Handbook.......2000-04-05

Excellent Handbook. Logically laid out. Has lots of data with out a lot index referencing. The handbook has material information as well as conversions and basic mathematical principles. This book takes you from the basics to detailed electro mechanical systems. a must for any Mechanical Engineer

Thermal Management Handbook: For Electronic Assemblies

Average customer rating:

Excellent casual referance

Thermal Management Handbook: For Electronic Assemblies
Jerry E. Sergent , Al Krum , and IMAPS (ISHM)
Manufacturer: McGraw-Hill Professional
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Binding: Hardcover

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ASIN: 0070266999

Book Description

In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.

Customer Reviews:

Excellent casual referance.......2001-06-01

This book has achieved just the right balance between throughness and overview so that I have been able to refer to it in a casual manner (once every 3-6 months) and been able to use the results without taking a new college course. I am a practicing Analog electronics engineer and thermal engineering is something I only do once (perhaps more ?) during a design/project.

Handbook of Lens Design (Optical Engineering Series, Vol 44)

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Handbook of Lens Design (Optical Engineering Series, Vol 44)
Daniel Malacara , and Zacarias Malacara
Manufacturer: Marcel Dekker
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Binding: Hardcover

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ASIN: 0824792254

Book Description

This practical reference/text provides comprehensive coverage of geometrical optics from basic principles to the most advanced topics and presents its applications in the design, optimization, and evaluation of lenses and optical instruments. Introduces a new approach to the derivation of primary aberration coefficients! Discussing the classical as well as current aspects of the field, Handbook of Lens Design describes modern methods, tools, and instruments, such as astronomical telescopes, Gaussian beams, and computer lens design examines spherical and a spherical optical surfaces and exact skew ray tracing defines the basic concepts of the first and third order theory of lenses and develops the theory of primary aberrations of centered optical systems explains the diffraction effects in optical systems and the main wave and ray methods for lens design evaluation lists standard optical instruments and delineates their design techniques demonstrates the procedures and methods for the automatic design of lens systems and more!

Transducers in Mechanical and Electronic Design (Mechanical Engineering (Marcell Dekker))

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Transducers in Mechanical and Electronic Design (Mechanical Engineering (Marcell Dekker))
Harry L. Trietley
Manufacturer: CRC
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ASIN: 0824775988

Area Array Packaging Handbook: Manufacturing and Assembly

Average customer rating:

Very good on hand reference
Handy Packaging Handbook
Finally, THE Area Array Packaging Handbook is out

Area Array Packaging Handbook: Manufacturing and Assembly
Ken Gilleo
Manufacturer: McGraw-Hill Professional
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Binding: Hardcover

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ASIN: 0071374930

Book Description

*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)

Customer Reviews:

Very good on hand reference.......2002-02-01

It provides an efficient and valuable on hand quick reference to the industry. Depth of the content is also right for marketing and management people who need some knowledge of the field. The book is however, too simple for Electronic Engineer. On the other hand, the pictures inside are not in good resolution. Anyway, If you need an efficient reference, it save you at least several days or weeks time in browsing internet for your requested information.

Handy Packaging Handbook.......2002-01-31

Three competing technologies are presently battling for position in the high density microelectronics packaging arena. In this book, Ken Gilleo has corralled all three competitors - Ball Grid Array (BGA), Chip-Scale Packaging (CSP), and Flip Chip - in a single handbook that is a comprehensive reference, problem solver, and get-smart-fast source for packaging engineers, designers, production engineers, manufacturing specialists, and those from all of the other disciplines associated with microelectronics packaging.

The book brings together contributions from many of those disciplines by many talented contributors. The 38 authors include widely-known industry stars, such as Marie Cole, Dan Baldwin, Joe Fjelstad, Jennie Hwang, Wayne Johnson, Jan Vardaman, and Phil Zarrow, as well others equally expert in their own fields, if lesser known. Of course, the multi-talented Dr. Gilleo contributed several chapters, while editing the volume and riding herd on 37 cats.

The subjects covered begin with package concept and design and move through many of the intermediate stages of development and manufacture, to yields, costs, and markets. The 31 chapters are grouped into five major sections, following the flow from concept to markets.

Concepts and Design ranges in time from the pre-history of microelectronics (vacuum tubes) to the future history of packaging for current developments such as MEMS (microelectromechanical systems). After an industry overview and trends, chapters are devoted to each a wide variety of packaging, including arrays, stacked 3-dimensional, compliant ICs, and MEMS. Ken Gilleo gives a good overview of flip chip, and Marie Cole explains ceramic column grid arrays.

Materials addresses packaging ingredients. Coverage includes polymers, hermetic getters, the care and feeding of solder spheres, lead-free formulations (including their social and economic consequences), and conductive adhesives. Jennie Hwang's 59 page chapter on solder and solder paste is practically a book in itself.

Equipment and Processes is the largest section, with 11 chapters. It begins with Dan Baldwin detailing next-generation flip chip, and Wayne Johnson describing substrate design, assembly, underfills, and reliability. Rework includes chapters both for die attach rework and for BGA and CSP packages rework. Encapsulation, process development and control, and reliability have separate chapters, as do molding, screen printing and stenciling, high speed package mounting, and ovens.

Economics and Productivity begins with metrics: how to measure productivity, if any. The following chapter on cost estimating shows how to convert that productivity to profits. Both disciplines are overlooked in many texts and most companies.

Future considers the direction and destiny, both of electronic packaging and of packaging equipment, but not of the human race, and finds it pleasing. Convergences and their consequences on future packaging, and the expected evolution of SMT equipment, bring our forward-looking saga to a close.

The handbook format allows the experts to present their topics in free-standing chapters, as if they were consultants leaning over your shoulder. This format provides more practical detail than the broader but less specialized textbook format, at some sacrifice of the textbook's breadth and structure. These chapters vary in both the scope of the subject matter and in the depth of the presentation, ranging from 7 to 100 pages (mean = 24.06 pages, sigma =17.44 pages). The 400 illustrations (mean = 0.5 per page) make for easier understanding of the sometimes complex detail. Chapter-end references supply alternative sources for exploring further along these or tangential paths.

In summary, I recommend this book for gaining an understanding of the current state-of-the-art in these three packaging technologies, as an excellent reference for a wide variety of packaging topics, and as a valuable tool for solving present packaging problems and avoiding future ones.

Finally, THE Area Array Packaging Handbook is out.......2002-01-29

There are many books on packaging, but all of them do not discuss ALL the area array packages in details. This one does! This book include BGA, CGA, CSP, FLip Chip, HDI and MEMS. What make this book so cool is that it not only mention on the making of these devices, it also includes how to use them as in assembly.

I particularly loves the the way the arthur organizes the content. Each packaging technology is covered in their own chapter. The chapter starts with an introduction and background, the materials and processes in the making of the packages, the applications and the limitations, the process, materials like solder pastes and fluxes and equipments needed to assemble these packages.

This book is design for both packaging house and Assembly house. It is also very useful for Failure Analysis guys as well as this book enables the reader to "see" the construction, and henceforth the possible weakness, of each of the packages.

Book Description

Unarguably the leading hands-on guide in this rapidly expanding area of electronics, Keith Billings' new revision of his Switchmode Power Supply Handbook brings state-of-the-art techniques and developments to engineers at all levels. Offering sound working knowledge of the latest in topologies and clear, step-by-step approaches to component decisions, this Handbook gives power supply designers practical, solutions-oriented design guidance free of unnecessarily complicated mathematical derivations and theory. This thoroughly updated Handbook features many new fully worked examples, as well as numerous nomograms--everything you need to design today's smaller, faster, and cooler systems. Turn to just about any page, and you'll find cutting-edge design expertise on electronic ballast, power factor correction, new thermal management techniques, transformers, chokes, input filters, EMI control, converters, snubber circuits, auxiliary systems, and much more. The most comprehensive book on power supply design available anywhere, Switchmode Power Supply Handbook is the industry standard, now fully updated for the 21st century.

Customer Reviews:

Exelente reference book........2007-10-01

I always was thinking in buy or not this book becasue of some other customer opinions, so i took the risk and bought it.
Great book, a lot of information regrading tips for inductor, transformer, softstart, step-down and flyback, it has many pages about everything abouth SMPS and Linear Supply.
If you want a book for reference on SMPS, buy this one, it has many examples, calculations, etc, and is a pleasure read this book.
You will receive what you pay.
Saludos...

Useful and enjoyable.......2006-09-17

I bought this book as a complement to Abraham I. Pressman's Switching Power Supply Design.

These two books are very similar, but do not overlap all that much. I am glad to have them both.

This book can be used as a textbook or as a reference. It is so well organised you can find what you need very fast through the table of contents. Concepts are supported by schematics and graphs.

I am using this book to learn analog design and to learn to build my own switching power supplies.

A good book for its purpose.......2006-06-02

I recently purchased both this book, and Switching Power Supply Design by Abraham I. Pressman. I had cursory knowledge of SMPS from datasheets and appnotes from National Semiconductors and IRF.

Overall, i like the other book better. The chapter layouts speak to the intended purpose of the books. In this book, the progression is from the start of an off-line power supply to then end. instead of starting with what the switching power supply is, and such, this book starts with input circuitry and startup methods. some suitable off-line topolgies are detailed. It is only later in the book that the basic switching power supplies, like the buck converter are detailed. It makes sense -- these supplies are billed for regulation in the book.

I found some of this book annoying. for instance, the author often refers to bifilar windings. there is no glossary entry for this. the index refers to multiple pages where "bifilar" is mentioned, but it is never defined. Similarly, "flyback" is not defined.

if you want to learn power supplies, i reccomend the book by Abraham I. Pressman over this one.

What an adventure!.......2002-12-12

I did the right thing - I ordered this AND the venerable Abrahamson book.

Up until that time I had only discerned the subject in hints and veiled inter departmental discussions - and it was the start of a wonderful two months period in which so much was revealed - I have rarely enjoyed a book so much! Now look, I don't work for Mr Amazon.com, but I would urge you to get both. This book (the one by Keith Billings) has lots of detail which the Abrahamson book skips a wee bit. They dovetail together beautifully - and the Abrahamson book includes a bit more breadth on the possible topologies. One of my favorite chapters in THIS book is the excellent exposition on biploar and FET drive circuits. Its made very clear - this man is a BORN teacher...

This book even tells you how to select fuses, filter capacitors (the point being that the values you chose last month might well be right, but after this text you will know with far greater confidence, as it were)

I must say that the one thing that both books are a little light on is the subject of CUK convertors, which I will have to get wisdom on from elsewhere I guess. The other thing that NEITHER books mention, which in fact is hard to find, is the design of planar transformers. This is a complex area involving quite a lot of maths, so I've been told. You can find some material in IEEE transactions on power electronics, and similar journals, but you may have to hunt a bit. Philips / Ferroxcube are good for this, too.

The Abrahamson book covers current fed convertors. This includes a section on flyback current fed convertors - in which I think he forgot to elaborate on the case where the input transformer returns to the input, rather than the output, which appears to reduce input ripple and improves the power factor. But this case is handled quite well in the references given at the end of the chapter, so no matter. Its a very exciting chapter - but the Billings book doesn't cover them at all, which is a pity, since there's quite a lot of utility for these very stable topologies, involving quite light voltage and current strain on the switching transistors.

I wish the books could go on even further, but all I can be is grateful...

I must say also that the safety aspect of design is covered well in both books, both European and American.

Excelent refernce source.......1999-09-13

This book does an excelent job of providing facts and information needed to design switchmode supplies. It gives numerical examples and shows the underlying theories.

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